Functions and Uses：
1. “103 Low stress nickel” is used in the type of sulfuric acid nickel plating process or type of amino sulfonic acid nickel plating process.
2. Low internal stress. The semi bright and superior ductility make the 103 suitable to be the bottom deposit of precious metals and general metals.
3. This process is also suitable for printed circuit boards, semiconductors and other highly reliable electronic devices.
Operating Components：
Low stress Ni sulfate type:
Nickel sulfate 240 ~ 330g / L
Boric acid 30 ~ 45g / L
103 anode activator 50 ~ 100mL / L
103 supplements 6 ~ 18mL / L
Low stress Ni sulfa mate type:
Nickel sulfa mate 240 ~ 525g / L
Boric acid 30 ~ 45g / L
103S anode activator 50 ~ 100mL / L
103S supplements 2 ~ 18mL / L
Anode sulfur depolarized nickel or carbon nickel:
Temperature 52 ~ 60 ℃
PH 2.5 to 3.5
Current density 1.5 ~ 8.0 A / dm²
1. “103 Low stress nickel” is used in the type of sulfuric acid nickel plating process or type of amino sulfonic acid nickel plating process.
2. Low internal stress. The semi bright and superior ductility make the 103 suitable to be the bottom deposit of precious metals and general metals.
3. This process is also suitable for printed circuit boards, semiconductors and other highly reliable electronic devices.
Operating Components：
Low stress Ni sulfate type:
Nickel sulfate 240 ~ 330g / L
Boric acid 30 ~ 45g / L
103 anode activator 50 ~ 100mL / L
103 supplements 6 ~ 18mL / L
Low stress Ni sulfa mate type:
Nickel sulfa mate 240 ~ 525g / L
Boric acid 30 ~ 45g / L
103S anode activator 50 ~ 100mL / L
103S supplements 2 ~ 18mL / L
Anode sulfur depolarized nickel or carbon nickel:
Temperature 52 ~ 60 ℃
PH 2.5 to 3.5
Current density 1.5 ~ 8.0 A / dm²
